Meklēšana
Meklēšanas kritērijs:
Meklēt:
Meklēšanas rezultāts
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Designed to be welded.Materials: Mild Steel, Stainless Steel and AluminiumTo be sealed with standard or EMC HRT/HRTO and HRST. -
Designed to be bolted or castedMaterials: Mild Steel, Stainless Steel and AluminiumTo be sealed with standard or EMC HRT/HRTO and HRST. -
II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIIC T200 °C, T195 °C, T130 °C DbHeat shrink connectionMax. operating temp: +200°C -
II 2G Ex e IIC T2, T3 GbII 2D Ex tb IIIC T200 °C, T195 °C DbHeat shrink connectionSilicone (cold connection)Max. operating temp: +200°C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHOT - HOT connectionHOT - POWER CABLE connection-60 °C ... +200 °C -
non ExHOT - HOT connectionHOT - POWER CABLE connection-20 °C ... +85 °C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C
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II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIICSilicone (cold connection)Max. operating temp: +200°C
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