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II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIICSilicone (cold connection)Max. operating temp: +200°C -
II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIIC T200 °C, T195 °C, T130 °C DbHeat shrink connectionMax. operating temp: +200°C -
II 2G Ex e II 200 °C (T2), T3, T4 GbII 2D Ex tb II 2D Ex tb IIICSingle / Double / TripleFor heat shrink connectionFor cold (silicone) connection-55°C ... + 55°C -
Self-limitingII 2G Ex e IIC 200 °C (T2), T3, T4 Gbswitched off: +200 °C15 W/m, 25 W/m, 30 W/m, 45 W/m, 60 W/mAC 208 V up to 254 V
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