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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 80/100/115 °C Db IP66IP66MCB
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 80/100/115 °C Db IP66IP66Fuse-holder
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Thermosetting (GRP)
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Aluminium alloy
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP)
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP)
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Aluminium alloy
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP)
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP)
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II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIICSilicone (cold connection)Max. operating temp: +200°C
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II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIIC T200 °C, T195 °C, T130 °C DbHeat shrink connectionMax. operating temp: +200°C
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II 2G Ex e IIC T2, T3 GbII 2D Ex tb IIIC T200 °C, T195 °C DbHeat shrink connectionSilicone (cold connection)Max. operating temp: +200°C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHOT - HOT connectionHOT - POWER CABLE connection-60 °C ... +200 °C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C
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non ExHOT - HOT connectionHOT - POWER CABLE connection-20 °C ... +85 °C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C
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II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C
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