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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 80/100/115 °C Db IP66IP66Fuse-holder -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 80/100/115 °C Db IP66IP66MCB
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II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Thermosetting (GRP) -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Aluminium alloy -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP) -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP) -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 60/70 °C Db IP66IP66Aluminium alloy -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP) -
II 3G 2D Ex nR IIC T6 GcII 3G 2D Ex tb IIIC T 70 °C Db IP66IP66Thermosetting (GRP) -
ATEX, IECExZone 1 & Zone 2 (Gas/Vapour) and Zone 21 & Zone 22 (Dust/Powder)Housing – 316L stainless steel; Lens – Borosilicate glass 3.3316L stainless steel backplateLED, XENONIP66/IP67Can be triggered together or independently -
ATEX, IECExZone 1 & Zone 2 (Gas/Vapour) and Zone 21 & Zone 22 (Dust/Powder)Housing – Glass-Reinforced Polyester (GRP) with UV-resistant paint316L stainless steel backplateLED, XENONIP66/IP67Can be triggered together or independently -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C -
II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIICSilicone (cold connection)Max. operating temp: +200°C
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II 2G Ex e IIC 200 °C (T2), T3, T4 GbII 2D Ex tb IIIC T200 °C, T195 °C, T130 °C DbHeat shrink connectionMax. operating temp: +200°C
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II 2G Ex e IIC T2, T3 GbII 2D Ex tb IIIC T200 °C, T195 °C DbHeat shrink connectionSilicone (cold connection)Max. operating temp: +200°C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHOT - HOT connectionHOT - POWER CABLE connection-60 °C ... +200 °C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbSilicone (cold connection)Max. operating temp: +85°C
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non ExHOT - HOT connectionHOT - POWER CABLE connection-20 °C ... +85 °C -
II 2G Ex e IIC T5 GbII 2D Ex tb IIIC T95 °C DbHeat shrink connectionMax. operating temp: +85°C
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